Industry & Policy

Huawei licenses LogicFolding chip technology patent to Qualcomm

Original article in Korean화웨이, 퀄컴에 '로직폴딩' 칩 관련 특허 라이선스 제공

Outlet: AI Times
Published: Oct 7, 2026
Importance: 3/5

Summary

Huawei and Qualcomm signed a comprehensive cross-patent license agreement spanning multiple years, covering AI, 5G devices, computing, networking, and advanced packaging technologies. Huawei's LogicFolding technology enables higher chip efficiency without EUV equipment, helping narrow performance gaps under technology restrictions.

Read the originalaitimes.com · in Korean

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