Industry & Policy

Henkel showcases advanced packaging for AI and HBM at SEDEX 2026

Original article in Korean헨켈, SEDEX 2026서 AI·HBM 시대 위한 첨단 패키징 소재 솔루션 선보여

Outlet: AI Times
Published: Oct 6, 2026
Importance: 2/5

Summary

Henkel's Adhesive Technologies division will present advanced packaging materials for AI, high-bandwidth memory, and high-performance computing at SEDEX 2026 from October 14 to 16 in Seoul. The company will demonstrate solutions for increasingly complex semiconductor packaging.

#ai#henkel#hbm

Read the originalaitimes.com · in Korean

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